- Produttore：
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- Material：
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- Adhesive：
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- Backing, Carrier：
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- Thermal Conductivity：
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| Immagine | Parte | Produttore | Descrizione | MOQ | Azione | Azione | ||
|---|---|---|---|---|---|---|---|---|
|
T-Global Technology | THERM PAD 21.84MMX1... |
$0.1404
|
1 |
134,848
In-stock
|
Ottieni preventivo | ||
|
|
T-Global Technology | THERM PAD 21.84MMX1... |
$0.3549
|
1 |
22,638
In-stock
|
Ottieni preventivo | ||
|
|
T-Global Technology | THERM PAD 21.84MMX1... |
$0.6084
|
1 |
13,426
In-stock
|
Ottieni preventivo | ||
|
|
T-Global Technology | THERM PAD 21.84MMX1... |
$0.3952
|
1 |
343,000
In-stock
|
Ottieni preventivo | ||
|
|
T-Global Technology | THERM PAD 21.84MM X... |
$0.1443
|
1 |
343,000
In-stock
|
Ottieni preventivo | ||
|
|
Laird - Performance Materials | THERM PAD 21.84MMX1... |
$0.0000
|
1 |
343,000
In-stock
|
Ottieni preventivo | ||
|
|
Laird - Performance Materials | THERM PAD 21.84MMX1... |
$0.0000
|
1 |
343,000
In-stock
|
Ottieni preventivo |
