- Material：
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- Package Cooled：
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- Attachment Method：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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2 Dokumentacja
| Obraz | Część | Producent | Opis | MOQ | Magazyn | Akcja | ||
|---|---|---|---|---|---|---|---|---|
|
CUI Devices | HEATSINK TO-220 3.2W... |
$0.1182
|
1 |
343,000
In-stock
|
Być cytowanym | ||
|
|
CUI Devices | HEAT SINK, BGA, 18 ... |
$0.3978
|
1 |
155,036
In-stock
|
Być cytowanym |
