- Producent：
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- Package Cooled：
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- Attachment Method：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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5 Dokumentacja
| Obraz | Część | Producent | Opis | MOQ | Magazyn | Akcja | ||
|---|---|---|---|---|---|---|---|---|
|
WEC | HEAT SINK, EXTRUS... |
$0.4368
|
1 |
41,748
In-stock
|
Być cytowanym | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
$0.2416
|
1 |
343,000
In-stock
|
Być cytowanym | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
$0.4485
|
1 |
225,106
In-stock
|
Być cytowanym | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
$0.3081
|
1 |
59,290
In-stock
|
Być cytowanym | ||
|
|
CUI Devices | HEAT SINK, BGA, 25 ... |
$0.4992
|
1 |
67,326
In-stock
|
Być cytowanym |
