- Producent：
-
- Package Cooled：
-
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
3 Dokumentacja
| Obraz | Część | Producent | Opis | MOQ | Magazyn | Akcja | ||
|---|---|---|---|---|---|---|---|---|
|
Ohmite | HEATSINK BLACK A... |
$0.3948
|
1 |
343,000
In-stock
|
Być cytowanym | ||
|
|
Wakefield Thermal | HEAT SINK ELLIP F... |
$1.6488
|
1 |
343,000
In-stock
|
Być cytowanym | ||
|
|
Wakefield Thermal | HEAT SINK ELLIP F... |
$1.6747
|
1 |
343,000
In-stock
|
Być cytowanym |
