- Producent：
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- Package Cooled：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Material Finish：
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7 Dokumentacja
| Obraz | Część | Producent | Opis | MOQ | Magazyn | Akcja | ||
|---|---|---|---|---|---|---|---|---|
|
Aavid | BOARD LEVEL HEAT... |
$2.0460
|
1 |
343,000
In-stock
|
Być cytowanym | ||
|
|
Aavid | BOARD LEVEL HEAT... |
$1.0139
|
1 |
343,000
In-stock
|
Być cytowanym | ||
|
|
Aavid | BOARD LEVEL HEAT... |
$1.2976
|
1 |
343,000
In-stock
|
Być cytowanym | ||
|
|
Aavid | HEAT SINK |
$1.4016
|
1 |
343,000
In-stock
|
Być cytowanym | ||
|
|
Advanced Thermal Solutions, Inc. | PCIE EXTRUSION P... |
$47.4045
|
1 |
490
In-stock
|
Być cytowanym | ||
|
|
ASSMANN WSW Components | HEATSINK ALUM AN... |
$0.3588
|
1 |
343,000
In-stock
|
Być cytowanym | ||
|
|
Advanced Thermal Solutions, Inc. | PCIE EXTRUSION P... |
$24.8898
|
1 |
343,000
In-stock
|
Być cytowanym |
