- Producent：
-
- Material：
-
- Shape：
-
- Package Cooled：
-
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Material Finish：
-
5 Dokumentacja
| Obraz | Część | Producent | Opis | MOQ | Magazyn | Akcja | ||
|---|---|---|---|---|---|---|---|---|
|
Aavid | BOARD LEVEL HEAT... |
$2.0672
|
1 |
343,000
In-stock
|
Być cytowanym | ||
|
|
Aavid | BOARD LEVEL HEAT... |
$9.2835
|
1 |
343,000
In-stock
|
Być cytowanym | ||
|
|
Aavid | BOARD LEVEL HEAT... |
$0.0000
|
1 |
343,000
In-stock
|
Być cytowanym | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
$1.8642
|
1 |
17,934
In-stock
|
Być cytowanym | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
$1.6107
|
1 |
1,470
In-stock
|
Być cytowanym |
