- Producent：
-
- Material：
-
- Shape：
-
- Package Cooled：
-
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Material Finish：
-
8 Dokumentacja
| Obraz | Część | Producent | Opis | MOQ | Magazyn | Akcja | ||
|---|---|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEAT SINK ELLIP F... |
$1.5214
|
1 |
343,000
In-stock
|
Być cytowanym | ||
|
|
Aavid | HEATSINK TO-220 TA... |
$0.0000
|
1 |
343,000
In-stock
|
Być cytowanym | ||
|
|
WEC | 29MM HS ASSY ULTEM... |
$8.9973
|
1 |
9,604
In-stock
|
Być cytowanym | ||
|
|
Aavid | BOARD LEVEL HEAT... |
$0.0000
|
1 |
343,000
In-stock
|
Być cytowanym | ||
|
|
TE Connectivity AMP Connectors | 27MM PIN FIN HEASI... |
$0.0000
|
1 |
343,000
In-stock
|
Być cytowanym | ||
|
|
Ohmite | BLACK ANODIZED H... |
$0.8229
|
1 |
119,658
In-stock
|
Być cytowanym | ||
|
|
Aavid | HEATSINK TO-220 1.45... |
$1.2441
|
1 |
112,896
In-stock
|
Być cytowanym | ||
|
|
Wakefield Thermal | HEATSINK 21X21X12MM... |
$1.7667
|
1 |
40,866
In-stock
|
Być cytowanym |
