- Package Cooled:
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- Attachment Method:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Material Finish:
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6 Dokumentacja
Obraz | Część | Producent | Opis | MOQ | Magazyn | Akcja | ||
---|---|---|---|---|---|---|---|---|
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Wakefield Thermal | HEATSINK MED HEX... |
$20.0676
|
1 |
343,000
In-stock
|
Być cytowanym | ||
![]() |
Wakefield Thermal | HEATSINK NATURAL... |
$25.3727
|
1 |
343,000
In-stock
|
Być cytowanym | ||
![]() |
Wakefield Thermal | HI-POWER HEATSIN... |
$30.1275
|
1 |
343,000
In-stock
|
Być cytowanym | ||
![]() |
Wakefield Thermal | 4.75X36" EXTRUSION 4... |
$18.9735
|
1 |
2,450
In-stock
|
Być cytowanym | ||
![]() |
Wakefield Thermal | HI-POWER HEATSIN... |
$35.4900
|
1 |
343,000
In-stock
|
Być cytowanym | ||
![]() |
Wakefield Thermal | 4.75X12" EXTRUSION 4... |
$10.6119
|
1 |
6,076
In-stock
|
Być cytowanym |