- Producent：
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- Material：
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- Package Cooled：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Material Finish：
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5 Dokumentacja
| Obraz | Część | Producent | Opis | MOQ | Magazyn | Akcja | ||
|---|---|---|---|---|---|---|---|---|
|
Aavid | BOARD LEVEL HEAT... |
$0.0000
|
1 |
343,000
In-stock
|
Być cytowanym | ||
|
|
Aavid | BOARD LEVEL HEAT... |
$0.0000
|
1 |
343,000
In-stock
|
Być cytowanym | ||
|
|
Ohmite | HEATSINK TO-218,TO... |
$0.8151
|
1 |
29,988
In-stock
|
Być cytowanym | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
$2.2074
|
1 |
9,604
In-stock
|
Być cytowanym | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
$1.7472
|
1 |
490
In-stock
|
Być cytowanym |
