- Producent：
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- Package Cooled：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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3 Dokumentacja
| Obraz | Część | Producent | Opis | MOQ | Magazyn | Akcja | ||
|---|---|---|---|---|---|---|---|---|
|
CTS Corporation | HEATSINK FORGED ... |
$3.8007
|
1 |
343,000
In-stock
|
Być cytowanym | ||
|
|
CTS Corporation | HEATSINK FORGED ... |
$5.1231
|
1 |
343,000
In-stock
|
Być cytowanym | ||
|
|
CUI Devices | HEAT SINK, BGA, 45 ... |
$0.7917
|
1 |
91,336
In-stock
|
Być cytowanym |
