- Producent：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
23 Dokumentacja
| Obraz | Część | Producent | Opis | MOQ | Magazyn | Akcja | ||
|---|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 8.5... |
$0.1976
|
1 |
343,000
In-stock
|
Być cytowanym | ||
|
|
CUI Devices | HEAT SINK, BGA, 40 ... |
$0.4323
|
1 |
343,000
In-stock
|
Być cytowanym | ||
|
|
CUI Devices | HEAT SINK, BGA, 17 ... |
$0.2193
|
1 |
343,000
In-stock
|
Być cytowanym | ||
|
|
CUI Devices | HEAT SINK, BGA, 20 ... |
$0.2267
|
1 |
343,000
In-stock
|
Być cytowanym | ||
|
|
CUI Devices | HEAT SINK, BGA, 35 ... |
$0.5284
|
1 |
343,000
In-stock
|
Być cytowanym | ||
|
|
CUI Devices | HEAT SINK, BGA, 30.... |
$0.4914
|
1 |
53,214
In-stock
|
Być cytowanym | ||
|
|
CUI Devices | HEAT SINK, BGA, 12 ... |
$0.3549
|
1 |
5,292
In-stock
|
Być cytowanym | ||
|
|
CUI Devices | HEAT SINK, BGA, 21 ... |
$0.3627
|
1 |
343,000
In-stock
|
Być cytowanym | ||
|
|
CUI Devices | HEAT SINK, BGA, 40 ... |
$0.9867
|
1 |
343,000
In-stock
|
Być cytowanym | ||
|
|
CUI Devices | HEAT SINK, BGA, 35 ... |
$0.6435
|
1 |
115,444
In-stock
|
Być cytowanym | ||
|
|
CUI Devices | HEAT SINK, BGA, 14 ... |
$0.2886
|
1 |
230,692
In-stock
|
Być cytowanym | ||
|
|
CUI Devices | HEAT SINK, BGA, 27 ... |
$0.3471
|
1 |
101,822
In-stock
|
Być cytowanym | ||
|
|
CUI Devices | HEAT SINK, BGA, 18 ... |
$0.3978
|
1 |
155,036
In-stock
|
Być cytowanym | ||
|
|
CUI Devices | HEAT SINK, BGA, 23 ... |
$0.4056
|
1 |
155,624
In-stock
|
Być cytowanym | ||
|
|
CUI Devices | HEAT SINK, BGA, 23 ... |
$0.3276
|
1 |
170,618
In-stock
|
Być cytowanym | ||
|
|
CUI Devices | HEAT SINK, BGA, 21 ... |
$0.3471
|
1 |
176,204
In-stock
|
Być cytowanym | ||
|
|
CUI Devices | HEAT SINK, BGA, 45 ... |
$0.7917
|
1 |
91,336
In-stock
|
Być cytowanym | ||
|
|
CUI Devices | HEAT SINK, BGA, 40 ... |
$0.8697
|
1 |
118,776
In-stock
|
Być cytowanym | ||
|
|
CUI Devices | HEAT SINK, BGA, 10 ... |
$0.2613
|
1 |
68,208
In-stock
|
Być cytowanym | ||
|
|
CUI Devices | HEAT SINK, BGA, 17 ... |
$0.4212
|
1 |
65,954
In-stock
|
Być cytowanym |
