- Type：
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- Package Cooled：
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- Attachment Method：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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2 Dokumentacja
| Obraz | Część | Producent | Opis | MOQ | Magazyn | Akcja | ||
|---|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, EXTRUS... |
$0.2145
|
1 |
2,179,030
In-stock
|
Być cytowanym | ||
|
|
CUI Devices | HEAT SINK, BGA, 27 ... |
$0.3471
|
1 |
101,822
In-stock
|
Być cytowanym |
