- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Natural：
-
2 Dokumentacja
| Obraz | Część | Producent | Opis | MOQ | Magazyn | Akcja | ||
|---|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, EXTRUS... |
$0.2928
|
1 |
343,000
In-stock
|
Być cytowanym | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
$0.3081
|
1 |
59,290
In-stock
|
Być cytowanym |
