- Producent：
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- Package Cooled：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Material Finish：
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5 Dokumentacja
| Obraz | Część | Producent | Opis | MOQ | Magazyn | Akcja | ||
|---|---|---|---|---|---|---|---|---|
|
Aavid | BOARD LEVEL HEAT... |
$0.0000
|
1 |
343,000
In-stock
|
Być cytowanym | ||
|
|
Aavid | BOARD LEVEL HEAT... |
$0.0000
|
1 |
343,000
In-stock
|
Być cytowanym | ||
|
|
Aavid | BOARD LEVEL HEAT... |
$1.8962
|
1 |
343,000
In-stock
|
Być cytowanym | ||
|
|
Aavid | HEAT SINK |
$1.9773
|
1 |
222,460
In-stock
|
Być cytowanym | ||
|
|
Ohmite | HEATSINK AND CLI... |
$1.0491
|
1 |
1,587,992
In-stock
|
Być cytowanym |
