- Producent：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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15 Dokumentacja
| Obraz | Część | Producent | Opis | MOQ | Magazyn | Akcja | ||
|---|---|---|---|---|---|---|---|---|
|
CUI Devices | HEATSINK TO-220 4.1W... |
$0.0909
|
1 |
343,000
In-stock
|
Być cytowanym | ||
|
|
CUI Devices | HEATSINK TO-220 3.6W... |
$0.1159
|
1 |
343,000
In-stock
|
Być cytowanym | ||
|
|
CUI Devices | HEATSINK TO-220 3.6W... |
$0.1387
|
1 |
343,000
In-stock
|
Być cytowanym | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
$0.2106
|
1 |
343,000
In-stock
|
Być cytowanym | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 BL... |
$0.2613
|
1 |
34,496
In-stock
|
Być cytowanym | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
$1.0023
|
1 |
5,194
In-stock
|
Być cytowanym | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
$1.2012
|
1 |
7,056
In-stock
|
Być cytowanym | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
$0.3822
|
1 |
193,060
In-stock
|
Być cytowanym | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
$0.4368
|
1 |
237,552
In-stock
|
Być cytowanym | ||
|
|
NTE Electronics, Inc. | HEATSINK FOR TO22... |
$0.5070
|
1 |
31,066
In-stock
|
Być cytowanym | ||
|
|
CUI Devices | HEATSINK TO-220 2.3W... |
$0.1872
|
1 |
66,444
In-stock
|
Być cytowanym | ||
|
|
CUI Devices | HEATSINK TO-220 2.9W... |
$0.2223
|
1 |
28,714
In-stock
|
Być cytowanym | ||
|
|
CUI Devices | HEATSINK TO-220 4.1W... |
$0.2808
|
1 |
37,436
In-stock
|
Być cytowanym | ||
|
|
CUI Devices | HEATSINK TO-220 4W ... |
$0.2964
|
1 |
19,600
In-stock
|
Być cytowanym | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
$1.4001
|
1 |
8,820
In-stock
|
Być cytowanym |
