- Producent：
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- Material：
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- Package Cooled：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Material Finish：
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5 Dokumentacja
| Obraz | Część | Producent | Opis | MOQ | Magazyn | Akcja | ||
|---|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, EXTRUS... |
$0.2638
|
1 |
343,000
In-stock
|
Być cytowanym | ||
|
|
TE Connectivity AMP Connectors | 5 FINS,2.000 OD HS W/... |
$0.0000
|
1 |
343,000
In-stock
|
Być cytowanym | ||
|
|
TE Connectivity AMP Connectors | 5 FINS,2.000 OD HS W/... |
$0.0000
|
1 |
343,000
In-stock
|
Być cytowanym | ||
|
|
TE Connectivity AMP Connectors | 5 FINS,2.000 OD HS W/... |
$0.0000
|
1 |
343,000
In-stock
|
Być cytowanym | ||
|
|
TE Connectivity AMP Connectors | 5 FINS,2.000 OD HS W/... |
$0.0000
|
1 |
343,000
In-stock
|
Być cytowanym |
