Producent:
  • (2)
  • (1)
Package Cooled:
Attachment Method:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Natural:
Obraz Część Producent Opis MOQ Magazyn Akcja
ATS-PCB1070 Advanced Thermal Solutions, Inc.
HEATSINK TO-220 BL...
$0.3198
1
54,978
In-stock
Być cytowanym
HSB03-141406 CUI Devices
HEAT SINK, BGA, 14 ...
$0.2886
1
230,692
In-stock
Być cytowanym
ATS-PCB1069 Advanced Thermal Solutions, Inc.
HEATSINK TO-220 BL...
$0.2886
1
42,336
In-stock
Być cytowanym
1 / 1 Page, 3 Records