- Producent：
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- Package Cooled：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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2 Dokumentacja
| Obraz | Część | Producent | Opis | MOQ | Magazyn | Akcja | ||
|---|---|---|---|---|---|---|---|---|
|
CTS Corporation | HEATSINK FORGED ... |
$1.9830
|
1 |
343,000
In-stock
|
Być cytowanym | ||
|
|
CUI Devices | HEAT SINK, BGA, 27 ... |
$0.7527
|
1 |
45,668
In-stock
|
Być cytowanym |
