- Material：
-
- Attachment Method：
-
- Thermal Resistance @ Forced Air Flow：
-
3 Dokumentacja
| Obraz | Część | Producent | Opis | MOQ | Magazyn | Akcja | ||
|---|---|---|---|---|---|---|---|---|
|
CUI Devices | HEATSINK TO-220 6.5W... |
$0.1466
|
1 |
343,000
In-stock
|
Być cytowanym | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
$0.4135
|
1 |
343,000
In-stock
|
Być cytowanym | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
$0.2829
|
1 |
343,000
In-stock
|
Być cytowanym |
