- Package Cooled：
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- Attachment Method：
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- Thermal Resistance @ Forced Air Flow：
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2 Dokumentacja
| Obraz | Część | Producent | Opis | MOQ | Magazyn | Akcja | ||
|---|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, STAMPI... |
$0.2106
|
1 |
343,000
In-stock
|
Być cytowanym | ||
|
|
CUI Devices | HEAT SINK, BGA, 17 ... |
$0.4212
|
1 |
65,954
In-stock
|
Być cytowanym |
