- Producent：
-
- Type：
-
- Package Cooled：
-
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
3 Dokumentacja
| Obraz | Część | Producent | Opis | MOQ | Magazyn | Akcja | ||
|---|---|---|---|---|---|---|---|---|
|
CTS Corporation | HEATSINK FORGED ... |
$2.2019
|
1 |
343,000
In-stock
|
Być cytowanym | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
$0.2856
|
1 |
343,000
In-stock
|
Być cytowanym | ||
|
|
CTS Corporation | HEATSINK FORGED ... |
$2.5063
|
1 |
343,000
In-stock
|
Być cytowanym |
