- Producent：
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- Material：
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- Package Cooled：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Material Finish：
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7 Dokumentacja
| Obraz | Część | Producent | Opis | MOQ | Magazyn | Akcja | ||
|---|---|---|---|---|---|---|---|---|
|
Aavid | BOARD LEVEL HEAT... |
$0.5426
|
1 |
343,000
In-stock
|
Być cytowanym | ||
|
|
Aavid | HEATSINK BGA W/AD... |
$2.9757
|
1 |
10,584
In-stock
|
Być cytowanym | ||
|
|
NTE Electronics, Inc. | HEAT SINK PLAST.P... |
$0.3432
|
1 |
25,186
In-stock
|
Być cytowanym | ||
|
|
Aavid | HEATSINK BGA W/AD... |
$1.7628
|
1 |
275,968
In-stock
|
Być cytowanym | ||
|
|
Aavid | BOARD LEVEL HEAT... |
$1.0296
|
1 |
447,076
In-stock
|
Być cytowanym | ||
|
|
Aavid | HEATSINK TO-220 TI... |
$0.4407
|
1 |
577,710
In-stock
|
Być cytowanym | ||
|
|
Aavid | HEATSINK TO-220 LI... |
$0.6591
|
1 |
81,242
In-stock
|
Być cytowanym |
